Yida LI
Assistant Professor

Dr. Yida Li is currently an Assistant Professor at the Southern University of Science and Technology, Shenzhen, China. He graduated from the National University of Singapore with a Ph.D. degree in Integrative Science and Engineering Program in 2013. From 2014 to 2016, he was with Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu as a process R&D principal engineer working on metal deposition and sillicidation at the 7/5 nm technology node, with both technology node currently in mass production. From 2016 to 2020, he was a research fellow at the National University of Singapore working with Professor Aaron Thean.

Dr. Li has published more than 45 papers in international academic journals and conferences. His work presented in VLSI 2018, Honolulu, USA was featured in prominent industry magazine, Compound Semiconductor. In addition, he has given invited talks at renowned international conferences including Graphene Flagship 2019 and VLSID 2020.


Dr. Li welcomes individuals passionate in research to join his research group. He has openings for Research Assistant Professor, Postdoctoral Fellows, Research Assistants, Graduate Students, as well as Internships. Interested individuals are invited to email a copy of his/her CV to his email address, with subject titled “Research position application <Position, Name>”.



Educational Background

2013, Doctor of Philosophy, National University of Singapore

2009, Bachelor of Electrical and Computer Engineering (1st Hons), National University of Singapore


Professional Experience

9/20209 - Present,Assistant Professor, Southern University of Science and Technology, Shenzhen, China

9/2016 – 9/2020,Research Fellow, National University of Singapore

8/2014 – 9/2016,R&D Principal Engineer, Taiwan Semiconductor Manufacturing Company

11/2013 – 8/2014,Research Fellow, National University of Singapore


Research Interests

  1. Novel memory and logic devices targeting at Non-Von Neumann computing architecture and neuromorphic circuits

  2. Additive processing and heterogeneous integration of materials to create the new generation of hybrid-flexible wearable devices


Honors & Awards

2020 Microwave and Wireless Components Letters Tatsuo Itoh Prize of the IEEE Microwave Theory and Techniques Society (MTT-S)

Invited talk, International Conference on VLSI Design, Bangalore, 2020

Invited talk, Graphene Flagship, Helsinki, Finland, 2019

Featured paper at Compound Semiconductor (VLSI 2018, Honolulu, USA) - https://compoundsemiconductor.net/article/105341/Showcasing_The_Compounds_At_VLSI/feature

Bachelor Degree with First Class Honors in Electrical and Computer Engineering, National University of Singapore, 2009


Selected Publications

  1. Y. Li, X. Feng, M. Sivan, J. F. Leong, B. Tang, X. Wang, J. N. Tey, J. Wei, K. W. Ang and A. V. Y. Thean, Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton with Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration, IEEE Sensors,vol. 20, no. 9, pp. 4653-4659, May 2020

  2. J. Pan, Y. Luo, Y. Li*, C. Tham, C. Heng and A. V. Thean, "A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-based Gesture Recognition with AI at the Edge," in IEEE Transactions on Circuits and Systems II: Express Briefs, DOI: 10.1109/TCSII.2020.3010318. *co-first (Early Access)

  3. Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng, “A 70μW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver”, 2020 IEEE International Solid-State Circuits Conference, pp. 346-348, 2020

  4. B. Xiong, Y. Li, A. V. Thean and C. Heng, "A  7 x 7  x 2 mm3 8.6- µW 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications," in IEEE Journal of Solid-State Circuits, vol. 55, no. 6, pp. 1698-1708, June 2020

  5. Y. Luo, Y. Li, A. V. Thean and C. Heng, "An 8.2- µW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter," in IEEE Journal of Solid-State Circuits, vol. 55, no. 5, pp. 1361-1373, May 2020

  6. Maheswari Sivan, Yida Li*, Hasita Veluri, Yunshan Zhao, Tang Baoshan, Xinghua Wang, Evgeny Zamburg, Jin Feng Leong, Jessie Xuhua Niu, Umesh Chand & Aaron Voon-Yew Thean*, All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration, Nat Comms, 10, 5201, November 2019

  7. Y. Li, A. Alian, M. Sivan, L. Huang, K.-W. Ang, D. Lin, D. Mocuta, N. Colleart, and A. V.-Y. Thean, “A Flexible InGaAs Nanomembrane PhotoFET with Tunable Responsivities in Near- & Short-Wave IR Region for Lightweight Imaging Applications”, APL Materials, February 2019

  8. Y. Li, Y. Luo, S. Nayak, Z. Liu, O. Chichvarina, E. Zamburg, X. Zhang, Y. Liu, C. H. Heng, A. V.‐Y. Thean, A Stretchable-Hybrid Low-Power Monolithic ECG Patch with Microfluidic Liquid-Metal Interconnects and Stretchable Carbon-Black Nanocomposite Electrodes for Wearable Heart Monitoring, Advanced Electronic Materials, October 2019

  9. Y. Li, Suryakanta Nayak, Yuxuan Luo, Yijie Liu, Hari Krishna Salia Vijay, Jieming Pan, Zhuangjian Liu, Chun Huat Heng, and Aaron Voon-Yew Thean, "A Soft PDMS-Liquid Metal Interdigitated Capacitor Sensor and Its Integration in a Flexible Hybrid System for On-Body Respiratory Sensing", Materials, 12 (9), 1458, 2019

  10. Suryakanta Nayak, Yida Li, Willie Tay, Evgeny Zamburg, Devendra Singh, Chengkuo Lee, Soo Jin Adrian Koh, Patrick Chia, Aaron Voon-Yew Thean, "Liquid-Metal-Elastomer Foam for Moldable Multi-Functional Triboelectric Energy Harvesting and Force Sensing", Nano Energy, 64, 103912, 2019.

  11. X. Feng, Y. Li, L. Wang, S. Chen, Z. G. Yu, W. C. Tan, N. Macadam, G. Hu, L. Huang, L. Chen, X. Gong, D. Chi, T. Hasan, A. V.-Y. Thean, Y.-W. Zhang, and K.-W. Ang, "A fully-printed flexible MoS2 memristive artificial synapse with femto joules switching energy," Advanced Electronic Materials 5, 1900740, 2019

  12. X. Feng, Y. Li, Lin Wang, Zhi Gen Yu, Shuai Chen, Wee-Chong Tan, Nasiruddin Macadam, Guohua Hu, Xiao Gong, Tawfique Hasan, Yong-Wei Zhang, Aaron Voon-Yew Thean and Kah-Wee Ang, “First Demonstration of Fully-printed RRAM on Flexible Substrate Featuring Low Switch Voltage and its Application as Electronic Synapse”, Proceedings of VLSI, 2019

  13. Hasita Veluri, Yida Li*, Maheswari Sivan, Jessie Xuhua Niu, Umesh Chand, Jin Feng Leong, Evgeny Zamburg, Subhranu Samanta, Xiao Gong, Kelvin Xuanyao Fong, and Aaron Voon-Yew Thean*, Novel Dot-Product Engine for Low-Voltage Analog Oxide ReRAM Array, SSDM proceedings, Osaka, 2019. *Corr-author

  14. Y. Li et al, Aerosol Jet Printed WSe2 Based RRAM on Kapton Suitable for Flexible Monolithic Memory Integration, 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2019

  15. B. Xiong, Y. Li, Aaron Voon-Yew Thean, Chun-Huat Heng, A 7×7×2mm3 8.6-μW 500-kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications, CICC Proceedings, 2019

  16. Hari Krishna Salila Vijayalal Mohan, Wai Kit Chee, Yida Li, Suryakanta Nayak, Chueh Loo Poh, Aaron Voon Yew Thean, "A highly sensitive graphene oxide based label-free capacitive aptasensor for vanilin detection", Materials & Design, 2019

  17. Y. Luo, Y. Li, A. V.-Y. Thean and C.-H. Heng, An 8.2-μW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter, Journal of Solid-State Circuits, IEEE Journal of Solid-State Circuits. PP. 1-13., 2019, DOI:10.1109/JSSC.2019.2949232.

  18. Y. Li, A. Alian, L. Huang, K. W. Ang, D. Lin, D. Mocuta, N. Collaert, and A V-Y Thean, A Near- & Short-Wave IR Tunable InGaAs Nanomembrane PhotoFET on Flexible Substrate for Lightweight and Wide-Angle Imaging Applications, 2018 Symposium on VLSI Technology, Honolulu, USA, Jun. 18-22, 2018

  19. Li, Rongqiang; Guo, Yong-Xin; Chen, Wei; Li, Yida; Aaron, Thean Voon Yew, “A Flexible Liquid-Metal Alloy Bandpass Filter”, International Journal of RF and Microwave Computer-Aided Engineering, 28(5), Feb 2018

  20. W. Chen, Y. Li, R. Li, A. V.-Y. Thean, and Y.-X. Guo, “Bendable and Stretchable Microfluidic Liquid Metal Based Filter With Stable Filtering Performance”, IEEE Microwave and Wireless Components Letters 28 (3), 203-205, 2018

  21. W. S. Leong, X. Luo, Y. Li*, K. H. Khoo, S. Y. Quek, and T. L. Thong, “Low Resistance Metal Contacts to MoS2 Devices with Nickel-Etched-Graphene Electrodes”, ACS Nano, 9 (1), pp 869–877, 2015. *co-first

  22. W.S. Leong,   Y. Li*,   X. Luo, C. T. Nai, S. Y. Quek and T. L. Thong, “Tuning the threshold voltage of MoS2 field-effect transistors via surface treatment”, Nanoscale, 7, 10823-10831, 2015.*co-first

  23. Y. Li, K. Buddharaju, S. J. Lee, and T. L. Thong, “Suppression of Void Formation in Si0.5Ge0.5 Alloy Nanowire during Ni Germanosilicidation”, Advanced Engineering Materials, 16 (8), pp. 1032–1037, 2014

  24. Y. Li, K. Buddharaju, N. Singh, G. Q. Lo, and S.J Lee, “Chip-Level Thermoelectric Power Generators based on High Density Silicon Nanowire Array Prepared with Top-down CMOS Technology”, IEEE Electron Device Letter, 32 (5), May 2011

  25. Y. Li, K. Buddharaju, N. Singh, and S.J Lee, “Improved Vertical Silicon Nanowire based Thermoelectric Power Generator with Polyimide Filling”, IEEE Electron Device Letter 33 (5), March 2012