Professor Yuejin Guo, currently is research professor at the School of  Microelectronics, Southern University of Science and Technology. Professor Guo graduated from the California Institute of Technology and is an IC chip packaging expert.  The high-performance thermal conductive materials developed by professor Guo have been used in more than 95% of the world’ s high-end computers (data centers, cloud computing, supercomputing, etc.). Using quantum chemistry and molecular dynamics methods to study the electrical, thermal, and mechanical properties of materials, his papers published in Science (2 papers, 1 first author paper) and Nature (1 first author paper) have been cited  for nearly a thousand times. Currently, he leading a research project–Key Research and Development Plan of Guangdong Province(2021-2024). Its fan-out packaging project won the champion of industry in the Shenzhen "Entrepreneurship Star" competition in 2018 (No.1 in more than 4,000 innovative companies in the world).

Hiring

Professor Yuejin Guo welcomes individuals passionate in research to join his research group. He has openings for Research Assistant Professor, Postdoctoral Fellows, Research Assistants, Graduate Students, as well as Internships. Interested individuals are invited to email a copy of his/her CV to his email address, with subject titled “Research position application <Position, Name>”.

Contact：guoyj@sustech.edu.cn

Educational Background

1986-1992, California Institute of Technology, Physical Chemistry, Ph.D.

1982-1985, Jilin University, Physical chemistry, Master

1978-1982, Jilin University, Semiconductor materials, Bachelor

Professional Experience

2018 to present, Southern University of Science and Technology, Research professor

2017-2018, Shenzhen Xiuyuan Electronic Technology Co., LTD., Vice President

1994-1995, Los Alamos National Laboratory, Postdoc

1992-1994, California Institute of Technology, USA, Postdoc 

Awards

In 2018, won the champion of industry in the Shenzhen "Entrepreneurship Star" competition (the first place among more than 4,000 innovative companies in the world)

In Intel Corporation, won ten times of divisional award

Research Interest

1. Research on 3d Chiplet and other advanced chip packaging materials and technology

2. Research on packaging substrate and heat dissipation materials

3. Research on heat dissipation of high power gallium nitride RF devices

4. Material calculation, Material simulation

Research Publications

[1] M. MAHROKH, HONGYU YU*, AND YUEJIN GUO*; Thermal Modeling of GaN HEMT Devices With Diamond Heat-Spreader, IEEE Journal of The Electron Devices Society, 2020, 8: 986-991.

[2]  Lii, M. Sankman, B., Azimi, H., Yeoh, H. & Guo, Y*; Flip-Chip Technology on Organic Pin GridArray Packages, Intel Technology Journal, 2000, 1-8.

[3] Y. Guo and W. A. Goddard III*; Is carbon nitride harder than diamond? No, but its girth increases when stretched (negative Poisson ratio), Chemical Physics Letters, 1995, 237:72-76.

[4] Y. Guo, N. Karasawa, and W. A. Goddard III*; Prediction of fullerene packing in C60 and C70 crystals, Nature, 1991, 351:464-467.

[5] G. Chen, J-M. Langlois, Y. Guo, and W. A. Goddard III*; Magnon-Exchange Pairing and Superconductivity, Science, 1989, 547.

[6] Y. Guo, J-M. Langlois, and W. A. Goddard III*; Electronic structure and valence-bond band structure of cuprate superconducting materials, Science, 1988, 239:896-899