Dr. Guimei Zhu, Research Associate Professor at School of Microelectronics of Southern University of Science and Technology (SUSTech), obtained her Master’s degree from Department of Modern Physics at University of Science and Technology of China (USTC) and earned her Ph.D. from National University of Singapore, respectively. Her career spans from academia to industry, including roles as a Research Scientist at Institute of High Performance Computing (IHPC), A*STAR(Singapore), and Research Scientist at Radi-Cool company (USA). In 2022, she joined SUSTech as a Research Associate Scientist, focusing on thermal management and design for integrated circuits/semiconductor chips, machine learning/artificial intelligence assisted materials design, solid-state refrigeration, and related applications. She has authored or co-authored over 30 papers as first/corresponding author in top-tier journals, including Nature Sustainbility, Chemical Review, Advanced Science, Material Today Physics, npj Flexible Electronics, Phys Rev B,E, Chinese Physics Letters et al, spanning materials science and engineering, physics, chemistry, and AI for materials and engineering. She is Editorial Board member of Thermo-X, and referees for top journals including Nature Communication and Advanced Science.

Educational Background

Ph.D, National University of Singapore (NUS),

Master, University of Science and Technology of China (USTC)

Professional Experience

Research Associate Professor, School of Microelectronics, Southern University of Science and Technology, Shenzhen, China

Research Scientist, Radi-Cool company, Boulder, USA

Visiting Scholar, Department of Mechanical Engineering, University of Colorado, Boulder, and University of California, Berkeley, USA

Research Scientist, Institute of High Performance Computing, A*STAR, Singapore

Research Associate, Centre for Computational Science and Engineering, National University of Singapore.

Honors

The second Prize of 2025 SUSTech Teaching Award,

Editorial Board member of Thermo-X,

Guest Editor of the journal Polymers ,

National University of Singapore (NUS), NUS Graduate School for Integrative Sciences and Engineering (NGS), Full Special Scholarship.

Complex Systems Summer School (CSSS2009), fully scholarship and travel grant support from Santa Fe Institute, Santa Fe, USA.

Research Fields

Thermal management and design for integrated circuits/semiconductor chips,

Machine learning/Artificial intelligence assisted materials design,

Solid-state cooling

Heat transfer in Complex network structures

Selected Publications 

P. Zhu, J. Zhang, B. Wei, B. Li, G. Zhu*, Liquid metal enabled thermal switch for active thermal management, International Journal of Heat and Mass Transfer 254, 127654 (2025).

W. Luo, X. Zhang, T. Luo, B. Li, B. Wei*, J. Zhang*, G. Zhu*, A Flexible Thermal Interface Material as the Heat Switch for Solid-State Cooling, Advanced Functional Materials, e12421 (2025).

J. Zhang, M. Chen, W. Luo, B. Wei, T. Luo, X. Shen*, B. Li*, G. Zhu*, Sustainable all-solid elastocaloric cooler enabled by non-reciprocal heat transfer, Nature Sustainability 8, 651-660 (2025).

T. Luo, C. Zhu, B. Li, X. Shen*, and G. Zhu*, Feature analysis aided design of lightweight heat sink from network structures, iScience 28, 111630 (2025).

C. Zhu, T. Luo, B. Li, X. Shen*, and G. Zhu*, Machine learning aided understanding and manipulating thermal transport in amorphous networks, Journal of Applied Physics 135, 195103 (2024).

J. Zhang, Y. Wu, Y. Lv, G. Zhu*, and Y. Zhu*, Mechanocaloric Effects Characterization of Low Crystalline Thermoplastic Polyurethanes Fiber, Polymers 16, 3360 (2024).

W. Luo, B. Wei, T. Luo, B. Li*, and G. Zhu*, 3D Network of Liquid Metal-Embedded Graphene via Surface Coating for Flexible Thermal Management, Small 20, 2406574 (2024).

B. Wei, W. Luo, J. Du, Y. Ding, Y. Guo, G. Zhu*, Y. Zhu*, and B. Li*, Thermal interface materials: From fundamental research to applications, SusMat 4, e239 (2024).

C. Zhu, E. Bamidele, X. Shen*, G. Zhu*, and B. Li*, Machine Learning Aided Design and Optimization of Thermal Matamaterials, Chemical Review 124,4258 (2024).  

C. Zhu, X. Shen*, G. Zhu*, and B. Li*, Prediction of Thermal Conductivity of Complex Networks with Deep Learning, Chinese Physics Letter Express 40, 124402 (2023). 

H. Chen, Y. Ding, G. Zhu*, Y. Liu, Q. Fang, X. Bai*, Y. Zhao*, X. Li, X. Huang, T. Zhang, B. Li and B. Sun*, A new route to fabricate flexible, breathable composites with advanced thermal management capability for wearable electronics, npj Flexible Electronics 7, 24 (2023). 

Y. Cheng, Z. Fan, T. Zhang, M. Nomura, S. Volz, G. Zhu*, B. Li*, and S. Xiong*, Magic angle in thermal conductivity of twisted bilayer graphene, Material Today Physics 35, 101093 (2023). 

G. Zhu*, H. Yang*, C. Yin, and B. Li*, “Localizations on Complex Networks”; Physical Review E 77, 066113 (2008).