Faculty
Research directions：
◆ Atomic level super finishing
◆ Plasma-assisted hybrid machining
◆ Electrochemistry-assisted hybrid machining
Educational background and working experience：
◆ 06/2026-
Professor (PI), Department of Mechanical and Energy Engineering, Southern University of Science and Technology
◆12/2022-05/2026
Associate professor (PI), Department of Mechanical and Energy Engineering, Southern University of Science and Technology
Assistant professor (PI), Department of Mechanical and Energy Engineering, Southern University of Science and Technology
Research Scientist, Singapore Institute of Manufacturing Technology (SIMTech), Singapore
◆ 04/2013-03/2016Research Fellow, Japan Society for Promotion of Science and Technology (JSPS) Osaka University, Osaka, Japan
◆ 04/2013-03/2016Ph.D., Osaka University, Department of Precision Science & Technology, Osaka, Japan
◆ 04/2011-03/2013M.A., Osaka University, Department of Precision Science & Technology, Osaka, Japan
◆ 08/2010-03/2011Research Assistant, Department of Precision Science & Technology, Graduate school of engineering, Osaka University, Osaka, Japan
◆ 09/2006-06/2010B.Sc., Huazhong University of Science & Technology, School of Mechanical Science and Engineering, Wuhan, China
◆ 09/2016
Rudolf Kingslake Award from Society of Photographic Instrumentation Engineers (SPIE), USA
◆ 02/2015
Chinese Government Award for Outstanding Self-Financed Students Abroad from the China Scholarship Council (CSC), China
◆ 10/2014
Best presentation Award at the 10th China-Japan International Conference on Ultra-Precision Machining (CJUPM2014), China
◆ 06/2014
Promotion Award of Machine Tool Technology of Japan from the Machine Tool Technology Promotion Foundation, Japan
◆ 05/2014
Distinguished Paper Award from the Mazak Foundation, Japan
◆ 11/2013
Best Presentation Award from the Japan Society of Abrasive Technology, Japan
◆ 03/2013
Excellent Student Award at the 9th China-Japan International Conference on Ultra-Precision Machining (CJUPM2013), Korea
◆ 09/2012
Best Presentation Award from the 10th International Conference on Progress of Machining Technology (ICPMT2012), Japan
◆ 11/2011
Best Paper Award at the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN2011), China
◆ 2011-2013
Sumitomo Scholar from Sumitomo Electric Group, Japan
Representative journal papers：
1. Zhang, J., Li, C., Wang, Y.*, Zhang, Y., Chen, Z., Yang, J., Deng, H.*, 2026, Atomic-scale reconstruction of sapphire induced by selective tribochemical removal of surface atoms, Nature Communications, 17/1: 4673 (IF: 15.7).
2. Zhang, Y., Xiao, Y., Liang, J., Zhang, C., Deng, H.*, 2025, Towards atomic-scale smooth surface manufacturing of β-Ga2O3 via highly efficient atmospheric plasma etching, International Journal of Extreme Manufacturing, 7/1: 015105 (IF: 21.3).
3. Yamamura, K.*, Deng, H.*, Sano, Y., Murata, J., Yang, X., Sun, R., 2025, Review of Physicochemical-assisted Nanomanufacturing Processes for Wide-bandgap Semiconductor Wafers, International Journal of Machine Tools and Manufacture, 211: 104321 (IF: 18.8).
4. Peng, P., Liu, X., Yang, S., Zhou, R., Deng, H., Gao, L., Fang, N. X.*, Liu, S.*, Zhu, J.*, 2025, Anomalous Photoelectrochemical Etching of Undoped Semiconductor Surfaces, Nature Communications, 16: 7885 (IF: 15.7).
5. Zhang, Y., Tang, J., Liang, S., Zhao, J., Hua, M., Zhang, C., Deng, H.*, 2024, Atomic-scale smoothing of semiconducting oxides via plasma-enabled atomic-scale reconstruction, International Journal of Machine Tools and Manufacture, 196: 104119 (IF: 18.8).
6. Guo, B., Kang, J., Zeng, T., Qu, H., Yu, S., Deng, H.*, Bai, J.*, 2022, 3D Printing of Multiscale Ti64-Based Lattice Electrocatalysts for Robust Oxygen Evolution Reaction, Advanced Science, 9: 2201751 (IF: 14.1).
7. Luo, H., Ajmal, K. M., Liu, W., Yamamura, K., Deng, H.*, 2021, Polishing and planarization of single crystal diamonds: state-of-the-art and perspectives, International Journal of Extreme Manufacturing, 3: 022003 (IF: 21.3).
8. Zhang, Y., Zhang, L., Chen, K., Liu, D., Lu, D., Deng, H.*, 2021, Rapid subsurface damage detection of SiC using inductively coupled plasma, International Journal of Extreme Manufacturing, 3: 035202 (IF: 21.3).
9. Luo, H., Ajmal, K. M., Liu, W., Yamamura, K., Deng, H.*, 2021, Atomic-scale and damage-free polishing of single crystal diamond enhanced by atmospheric pressure inductively coupled plasma, Carbon, 182: 175-184 (IF: 11.6).
10. Yi, R., Zhang, Y., Zhang, X., Fang, F., Deng, H.*, 2020, A generic approach of polishing metals via isotropic electrochemical etching, International Journal of Machine Tools and Manufacture, 150: 103517 (IF: 18.8).
11. Fang, Z., Zhang, Y., Li, R., Liang, Y., Deng, H.*, 2020, An efficient approach for atomic-scale polishing of single-crystal silicon via plasma-based atom-selective etching, International Journal of Machine Tools and Manufacture, 159: 103649 (IF: 18.8).
12. Deng, H., Endo, K., Yamamura, K.*, 2017, Damage-free finishing of CVD-SiC by a combination of dry plasma etching and plasma-assisted polishing, International Journal of Machine Tools and Manufacture, 155: 38-46 (IF: 18.8).
13. He, Q., Ren, J., Fan, Y., Zhang, Y., Xie, K., Deng, H.*, 2026, Atomic-level diamond surface fabrication by combining gas cluster ion beam amorphization and plasma-assisted polishing, CIRP Annals-Manufacturing Technology, 75: 727-731.
14. Deng, H., Wu, B., Zhang, J., Zhang, Z., Zhang, X.*, 2024, Highly efficient figuring of Si mirrors using an atmospheric plasma jet with concentrated electric field, CIRP Annals-Manufacturing Technology, 73: 413-416.
15. Deng, H.*, Zhang, Y., Liang, J., Zhang, X., 2023, Surface reconstruction of sapphire at the atomic scale via chemical-physical tuning of atmospheric plasma, CIRP Annals-Manufacturing Technology, 72: 489-492.
16. Zhang, X.*, Deng, H., Li, K.*, 2019, Oxygen-shielded ultrasonic vibration cutting to suppress the wear of diamond tools, CIRP Annals-Manufacturing Technology, 68: 69-72.
17. Deng, H., Monna, K., Tabata, T., Endo, K., Yamamura, K., 2014, Optimization of the plasma oxidation and abrasive polishing processes in plasma-assisted polishing for high effective planarization of 4H-SiC, CIRP Annals-Manufacturing Technology, 63: 529-532.
18. Deng, H., Yamamura, K., 2013, Atomic-scale flattening mechanism of 4H-SiC (0001) in plasma assisted polishing, CIRP Annals-Manufacturing Technology, 62: 575-578.
19. Yamamura, K., Takiguchi, T., Ueda, M., Deng, H., Hattori, A. N., Zettsu, N., 2011, Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface, CIRP Annals-Manufacturing Technology, 60: 571-574.